Self aligning small scale integrated circuit semiconductor chips to form large area arrays

作者: Dirk J. Bartelink , David K. Biegelsen

DOI:

关键词: SiliconMaterials scienceDiamondPlanarGeometric shapeIntegrated circuitWaferSemiconductorChipNanotechnologyOptoelectronics

摘要: Small scale integrated chips are fabricated from a semiconductor wafer and subsequently pretested formed into large area arrays with self aligning locking characteristics due to the axial orientation of geometries employed for based upon orientation, whereby spacing abutting chip edges in an array may be less than 7 μm. The wafer, e.g., silicon wherein boundaries aligned vertical {111} planes crystalline material so that each defined within parallelogrammatic like by these their intersections. term "parallelogrammatic geometries" means all geometric shapes capable being various structure wafer. Examples such parallelograms aspect ratios variations or combinations planar figures composed parallelograms. Specific examples diamond shaped chevron configurations.

参考文章(9)
Lawrence D. Simpson, Loring E. Du Bois, Electronic article with orientation-identifying surface shape ,(1977)
Rokutaro Ogawa, Tohru Hosomizu, Kenichi Ohno, Mitsuhisa Shimizu, Large scale semiconductor integrated circuit device ,(1978)
K.E. Bean, Anisotropic etching of silicon IEEE Transactions on Electron Devices. ,vol. 25, pp. 1185- 1193 ,(1978) , 10.1109/T-ED.1978.19250
James B. Angell, Stephen C. Terry, Phillip W. Barth, Silicon micromechanical devices Scientific American. ,vol. 248, pp. 44- 55 ,(1983) , 10.1038/SCIENTIFICAMERICAN0483-44
Igor Naumovich Larionov, Tom Pavlovich Chernetsky, Method of connecting electrically conducting bodies ,(1973)
Hans P Kleinknecht, Semiconductor device fabrication ,(1964)