Continuous Casting of Copper to Form Sputter Targets
作者： Melvin Holcomb
DOI:
关键词: Copper 、 Materials science 、 Sputtering 、 Coating 、 Substrate (printing) 、 Metallurgy 、 Continuous casting
摘要: Continuous casting of copper to produce sputter targets ( 20 ). The resulting comprise a relatively low amount inclusions therein and will result in reduced particulate sputtering leading more uniform coating that is sputtered onto the desired substrate.
lens.org 参考文章(22)
Tadanori Sano, Kenji Miyazaki, Yoshihiro Nakai, Kazuo Sawada, Method of manufacturing a copper electrical conductor, especially for transmitting audio and video signals and quality control method for such conductors ,(1994)
Herbert Lemper, Modular continuous caster ,(1989)
Vikram Pavate, Jaim Nulman, Seshadri Ramaswami, Murali Narasimhan, Glen Mori, Keith J. Hansen, Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies ,(1999)
Jean-Luc Meyer, Method of making thixotropic metal products by continuous casting ,(1989)
John M. A. Dompas, Metallic anodes manufactured from molten copper ,(1988)
Ernst Muller, Adolf Trautwein, Continuous casting processes and apparatus ,(1976)
Derek E. Tyler, Joseph Winter, Jonathan A. Dantzig, Method and apparatus for casting metals and alloys ,(1982)
Earl G. Powell, Mesh shield in a sputter reactor ,(2001)
Tadao Ueda, Lijun Yao, Process for producing sputtering target materials ,(2001)
Melvin K. Holcomb, David B. Smathers, Robert S. Bailey, Timothy Wiemels, Non-planar sputter targets having crystallographic orientations promoting uniform deposition ,(2003)