A new chip-thickness model for performance assessment of silicon carbide grinding
作者： Anne Venu Gopal , P. Venkateswara Rao
DOI: 10.1007/S00170-003-1788-6
关键词: Chip 、 Modulus 、 Grinding 、 Mechanical engineering 、 Silicon carbide 、 Grinding wheel 、 Engineering drawing 、 Materials science 、 Surface roughness
摘要: … where r is the chip width-to-thickness ratio, C is the number of active grits per unit area, Vw is the work velocity, Vs is the wheel velocity, ae is the work engagement and deq is the …
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