Predicting Microstructural-Level Residual Stresses and Crack Paths in Ceramics
作者： G.S. Rohrer , W.C. Cater , V.R. Vedula , S.J. Glass , D.M. Saylor
DOI:
关键词: Anisotropy 、 Thermal expansion 、 Finite element method 、 Materials science 、 Fracture mechanics 、 Fracture (geology) 、 Residual stress 、 Composite material 、 Metallurgy 、 Microstructure 、 Grain boundary
摘要: Microstructural-level residual stresses arise in ceramics due to thermal expansion anisotropy. The magnitude of these can be very high and may cause spontaneous microcracking during the processing materials. orientation data obtained by backscattered electron diffraction grain boundary energies AFM were used conjunction with an object oriented finite element analysis package (OOF) predict alumina. Crack initiation propagation also simulated based on Griffith fracture criterion.
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