Electrically driven chip cooling device using hybrid coolants of liquid metal and aqueous solution

摘要: Heat dissipation of electronic devices keeps as a tough issue for decades. As the most classical coolant in convective heat transfer process, water has been widely adopted which however inherits with limited thermal conductivity and relies heavily on mechanical pump. an alternative, room temperature liquid metal was increasingly emerging important to realize much stronger enhanced transfer. However, its capacity is somewhat lower than that water, may restrict overall cooling performance. In addition, high cost by taking too amount into device also turns out be big concern practical purpose. Here, through combining individual merits from both large capacity, we proposed demonstrated new conceptual integrated hybrid coolants, radiator annular channel together chip management. Particularly, electrically induced actuation effect introduced only flow driving strategy, significantly simplified whole system design. This enables sphere surrounding aqueous solution quickly accelerated speed under very low electric voltage. Further experiments could effectively maintain hotpot (3.15 W/cm2) below 55oC extremely small power consumption rate (0.8 W). Several situations simulate working were experimentally explored theoretical resistance model established evaluate The present work suggests way make highly compact device, can flexibly extended wide variety engineering areas.