Fluxless bonding of microelectronic chips
作者： Bertram Schwartz , Ralph Thomas Hepplewhite , Gerard Edmond Henein
DOI:
关键词: Electronic engineering 、 Optoelectronics 、 Semiconductor laser theory 、 Vacuum chamber 、 Microelectronics 、 Indium 、 Materials science 、 Light-emitting diode
摘要: Indium is used to bond semiconductor lasers their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding achieved in vacuum chamber reducing ambients CO or H2. Low strain bonds are at temperatures approximately 180°-240° C. and 220°-230° Void-free as low about 205° The technique applicable other microelectronic chips such LEDs, for example.
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