Copper clad laminate
作者： Seiji Nagatani , Masahiko Nakano , Takuya Yamamoto
DOI:
关键词: Metallurgy 、 Hot pressing 、 FOIL method 、 Materials science 、 Composite material 、 Copper 、 Production efficiency 、 Copper foil 、 Image warping
摘要: To reduce warping of a copper clad laminate coated with foils different thicknesses on both sides, and thereby to improve production efficiency the printed-wiring boards, there is provided wherein first foil one side not recrystallizable by hot pressing for said second other thicker than foil.
google.mg参考文章(35)
Derek Charles Carbin, John Francis Fatcheric, Copper foil for printed circuit boards ,(1995)
Takaaki Hatano, Yoshio Kurosawa, Rolled copper foil for flexible printed circuit and method of manufacturing the same ,(1999)
Tetsuro Sato, Kenichiro Iwakiri, Tsutomu Asai, Resin-coated composite foil, production and use thereof ,(1999)
Sakiko Mitsui Mining Smelting Co. Ltd Taenaka, Makoto Mitsui Mining Smelting Co. Ltd Dobashi, Akiko Mitsui Mining Smelting Co. Ltd Sugimoto, Naotomi Mitsui Mining Smelting Co. Takahashi, Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil ,(2000)
Tadashi Hirakawa, Kunio Nishimura, Epoxy resin-impregnated prepreg. ,(1989)
Hitoshi Kato, Tsukasa Akutsu, Process for preparing porous electrolytic metal foil ,(1996)
Daniel T. Schaefer, Kurt Richard Mikeska, Method for reducing shrinkage during firing of ceramic bodies ,(1991)
Yoshihiko Hyoudou, Takuya Matsuoka, Naoya Takagi, Hiroshi Kanai, Diagnostic apparatus for an evaporated fuel system, and vehicle control apparatus for a vehicle equipped with the diagnostic apparatus ,(2003)
Fuyuki Eriguchi, Seiichi Watanabe, Toshihiko Sugimoto, Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board ,(1995)
Makoto Dobashi, Kenichiro Iwakiri, Junshi Yoshioka, Tsutomu Higuchi, Shinichi Obata, Takuya Yamamoto, Sakiko Tomonaga, Takashi Kataoka, Yutaka Hirasawa, Akiko Sugimoto, Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil ,(2000)