Low-cost high-power electronic device packaging technology
作者： Zhang Yaohui , Peng Hu , Ma Wenzhen , Zeng Dajie
DOI:
关键词: Flange 、 Optoelectronics 、 Eutectic system 、 Welding 、 Packaging engineering 、 Gold plating 、 Power (physics) 、 Chip 、 Materials science 、 Layer (electronics)
摘要: The invention discloses a low-cost high-power electronic device packaging technology. technology comprises the steps that chip and flange for are prepared, thick gold layer or gold-tin is manufactured on back face of chip, nickel thin plated surface in sequence, mounting through gold-silicon eutectic welding welding. According to technology, flange, so good effect achieved, void content hot interface between reduced, radiating efficiency ensured, plating cost greatly number working procedures reduced.
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