Microstructure enhanced sinter bonding of metal injection molded part to a support substrate
作者： Laine Mears , Thomas Martens
DOI:
关键词: Substrate (printing) 、 Microstructure 、 Relative motion 、 Sintering 、 Composite material 、 Materials science 、 Metal
摘要: Composites that include a metal injection molded component bonded to support substrate and methods for forming the composites are described. Methods green part includes microstructures on surface of part. The is located adjacent with microstructure ends contacting at contact surface. During sintering microstructures. presence can allow relative motion between during sintering. large bonding area provided by multiple points provide excellent force substrate.
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