One-step fabrication of ultralow dielectric polyimide films consisting of size-controlled mesoporous nanoparticles

作者: Yunxia Jin , Jing Tang , Jun Hu , Xia Han , Yazhuo Shang

DOI: 10.1016/J.COLSURFA.2011.09.052

关键词: Materials sciencePolymer chemistryNanoparticlePolyimidePolymerDielectricCopolymerChemical engineeringFabricationMaleic anhydrideMesoporous material

摘要: Dielectric materials with ultralow dielectric constants (<2.0) are desiderated in the integrated circuits (ICs). In this work, we fabricated polyimide (PI) films consisting of mesoporous nanoparticles (MPNPs-PF) through a one-step solvent evaporation induced self-assembly method. Poly(amic acid) was selected as polymer matrix; and commercial triblock copolymer F127 adopted template well nanoparticle morphology controller, respectively. After imidization removal, dense closed-packed PI an average diameter less than 50 nm were obtained. Since fully composed worm-like mesopores, constant (k value) resultant porous can reach low 1.92. When reactive end-capper maleic anhydride (MA) blended into poly(amic acid), k value decreased even lower to 1.86. Meanwhile, modulus higher 1 GPa.

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