作者: Yunxia Jin , Jing Tang , Jun Hu , Xia Han , Yazhuo Shang
DOI: 10.1016/J.COLSURFA.2011.09.052
关键词: Materials science 、 Polymer chemistry 、 Nanoparticle 、 Polyimide 、 Polymer 、 Dielectric 、 Copolymer 、 Chemical engineering 、 Fabrication 、 Maleic anhydride 、 Mesoporous material
摘要: Dielectric materials with ultralow dielectric constants (<2.0) are desiderated in the integrated circuits (ICs). In this work, we fabricated polyimide (PI) films consisting of mesoporous nanoparticles (MPNPs-PF) through a one-step solvent evaporation induced self-assembly method. Poly(amic acid) was selected as polymer matrix; and commercial triblock copolymer F127 adopted template well nanoparticle morphology controller, respectively. After imidization removal, dense closed-packed PI an average diameter less than 50 nm were obtained. Since fully composed worm-like mesopores, constant (k value) resultant porous can reach low 1.92. When reactive end-capper maleic anhydride (MA) blended into poly(amic acid), k value decreased even lower to 1.86. Meanwhile, modulus higher 1 GPa.