Palladium layers deposition process

作者: Hartmut Mahlkow , Ludwig Stein , Waltraud Strache

DOI:

关键词: BoronPalladiumCobaltAdhesiveFormic acidCopperNickelMaterials scienceInorganic chemistryCementation (metallurgy)

摘要: Palladium layers are often used as protective on the surface of substrates made copper, nickel and cobalt, well their alloys with each other and/or phosphorous or boron. The known processes, however, allow no adhesive, permanently glossy, bright palladium few pores to be deposited. Such may however deposited from a formaldehyde-free chemical bath which contains salt, one several nitrogenated complexing agents formic acid derivatives at pH value higher than 4. Pretreating in cementation is also possible.

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