Thermal relaxation at interfaces following shock compression

作者: R. Grover , P. A. Urtiew

DOI: 10.1063/1.1662949

关键词: Thin layersTransient (oscillation)Thermal relaxationThermodynamicsMaterials scienceComposite materialShock (mechanics)Compression (physics)Thermal conductionGeneral Physics and Astronomy

摘要: Thermal conduction processes at material interfaces representative of those produced by shock compression are studied in order to understand the temperature history interface. The transient effects due small gaps and thin layers calculated, as well modifications a melting transition one materials.

参考文章(4)
Richard Grover, Liquid Metal Equation of State Based on Scaling The Journal of Chemical Physics. ,vol. 55, pp. 3435- 3441 ,(1971) , 10.1063/1.1676596
Horatio Scott Carslaw, John Conrad Jaeger, Conduction of Heat in Solids ,(1959)
P. A. Urtiew, R. Grover, Temperature deposition caused by shock interactions with material interfaces Journal of Applied Physics. ,vol. 45, pp. 140- 145 ,(1974) , 10.1063/1.1662948