Bonded three dimensional laminate structure
作者： Robert Daniel Hilty , Marjorie Kay Myers , Michael Fredrick Laub
DOI:
关键词: Intermetallic 、 Materials science 、 Metallic bonding 、 Metal 、 Electrical conductor 、 Composite material
摘要: A conductive structure and method of manufacturing therefor includes a plurality stacked metal laminates secured to one another via an intermetallic bond made from metallic bonding agent.
google.ca 参考文章(12)
Dimitry G. Grabbe, High density mold ,(1991)
John Chisholm, Process for making a high heat transfer surface composed of perforated or expanded metal ,(1980)
Stephen Lane, Troy Barbee, William Wilson, Michael Surh, Electrophoretic/electrochemical devices with nanometer-scale metallic components ,(2002)
James J Rochlis, Apertured and staggered molded pile product ,(1963)
Dimitry G. Grabbe, Method of constructing a monolithic block having an internal geometry and the block resulting therefrom ,(1990)
Paul W. Neagle, Matthew Schmidt, Sean P. Fitzgerald, Dongming Qiu, Gary Roberts, Anna Lee Y. Tonkovich, Methods of making devices by stacking sheets and processes of conducting unit operations using such devices ,(2003)
Saburou Kitaguchi, Susumu Okikawa, Method for producing a heat spreader and semiconductor device with a heat spreader ,(1998)
Hideo Shimada, Socket for electrical parts having spacer ,(2003)
Dimitry G. Grabbe, High density connector for an ic chip carrier ,(1990)
Akira Mori, Ikuo Uchino, Atsuhiko Hirosawa, Kunihiro Yamazaki, Metal particle detecting sensor, metal particle detecting method and metal particle detecting apparatus ,(1992)