Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
作者： Dinesh Chopra , Scott E. Moore
DOI:
关键词: Engineering 、 Polishing 、 Electronic engineering 、 Conditioning 、 Surface (mathematics) 、 Wafer 、 Mechanical engineering 、 Downstream (manufacturing)
摘要: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning web-shaped pad. The may be used to condition glazed portion of the pad, and then conditioned pad again polishing. preferably arranged apply different treatments portions have roller segments that rotate at speeds. Alternatively, non-cylindrical rollers provide rotational speeds surface, or pressures uniform across width invention applicable methods planarizing semiconductor wafers. circular pads in addition pads. adjusted controlled response surface characteristics data obtained by measuring polished
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