Fundamental Building Blocks for Circuits on Textiles

作者: I. Locher , G. Troster

DOI: 10.1109/TADVP.2007.898636

关键词: Electrical networkRealization (systems)Transmission lineIntegrated circuitElectronic circuitElectrical engineeringEngineeringElectronic engineeringElectric power transmissionLine (electrical engineering)Interposer

摘要: This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with specification hybrid fabric as substrate. The discussion textile transmission lines well interconnects reveals flat frequency response up to about 2 GHz and 600 MHz, respectively. proposed feature line impedances in range 250 Omega. A novel interposer concept is key technology our approach implementing textiles. introduce different variants this give formulas determine their area consumption. presented technologies allow wiring fabrics signal frequencies several hundred megahertz.

参考文章(23)
S. Jung, C. Lauterbach, M. Strasser, W. Weber, Enabling technologies for disappearing electronics in smart textiles international solid-state circuits conference. pp. 386- 387 ,(2003) , 10.1109/ISSCC.2003.1234347
B. Freyman, R. Marrs, Ball Grid Array (BGA): The New Standard For High I/O Surface Mount Packages japan international electronic manufacturing technology symposium. pp. 41- 45 ,(1993) , 10.1109/IEMT.1993.639328
E. Hirt, G. Troster, Early footprint comparison for area I/0 packages and first level interconnect electronic components and technology conference. pp. 1210- 1216 ,(1999) , 10.1109/ECTC.1999.776372
Steve Mann, Introduction: On the bandwagon or beyond wearable computing? Personal Technologies. ,vol. 1, pp. 203- 207 ,(1997) , 10.1007/BF01682022
R.A. Soares, P. Gouzien, P. Legaud, G. Follot, A unified mathematical approach to two-port calibration techniques and some applications IEEE Transactions on Microwave Theory and Techniques. ,vol. 37, pp. 1669- 1674 ,(1989) , 10.1109/22.41029
J. Grzyb, D. Cottet, G. Troster, Systematic deembedding of the transmission line parameters on high-density substrates with probe-tip calibrations electronic components and technology conference. pp. 1051- 1057 ,(2002) , 10.1109/ECTC.2002.1008232
J.A. Reynoso-Hernandez, Unified method for determining the complex propagation constant of reflecting and nonreflecting transmission lines IEEE Microwave and Wireless Components Letters. ,vol. 13, pp. 351- 353 ,(2003) , 10.1109/LMWC.2003.815695
D. Cottet, J. Grzyb, T. Kirstein, G. Troster, Electrical characterization of textile transmission lines IEEE Transactions on Advanced Packaging. ,vol. 26, pp. 182- 190 ,(2003) , 10.1109/TADVP.2003.817329
V. Beyer, F. Kuchenmeister, M. Bottcher, E. Meusel, Flexible polyimide interposer for CSP preparation Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180). pp. 112- 115 ,(1998) , 10.1109/ADHES.1998.742012
Eugene J. Rymaszewski, Rao R. Tummala, Y. C. Lee, Microelectronics packaging handbook ,(2012)