Relationship between rheological and electrical percolation in a polymer nanocomposite with semiconductor inclusions
作者： Ahmad Zohrevand , Abdellah Ajji , Frej Mighri
DOI: 10.1007/S00397-013-0750-2
关键词: Electrical resistivity and conductivity 、 Percolation threshold 、 Masterbatch 、 Materials science 、 Microstructure 、 Polymer nanocomposite 、 Scanning electron microscope 、 Percolation 、 Nanocomposite 、 Composite material
摘要: Microstructure, electrical conductivity, and rheological properties of nanocomposites based on isotactic polypropylene (iPP) containing semiconductor nanoparticles TiO2 were studied. Compatibilized uncompatibilized a wide range concentrations (up to 15 vol%) prepared by melt compounding in twin-screw extruder via masterbatch method. An anhydride-modified PP (AMPP) was used as the compatibilizer. Atomic force microscopy (AFM), scanning electron (SEM), image analysis techniques utilized study morphology evolution samples. Analyzing results direct current (DC) conductivity measurements showed lower percolation threshold for samples, compared compatibilized ones. In order estimate threshold, linear nonlinear melt-state viscoelastic samples Liquid-solid transition nonterminal behavior observed at relatively loading, It an indication which agreement with threshold. Scaling strain sweep tests above thresholds resulted fractal dimension
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