作者: Tachibana Yoshihisa
DOI:
关键词: Emissivity 、 Optoelectronics 、 Heat transfer 、 Current (fluid) 、 Thermoelectric effect 、 Cooling efficiency 、 Thermoelectric conversion 、 Materials science
摘要: PROBLEM TO BE SOLVED: To provide a thermoelectric device capable of displaying high conversion efficiency and its manufacturing method. SOLUTION: When current is made to flow in an adequate direction, high-temperature side insulating board 2 chips 1 rises temperature while low-temperature 3 the drops temperature. At this point, conventional structure, increased by heat released from parts which rise temperature, so that sufficient cooling performance can not be obtained sometimes. In device, sides are roughened, become low emissivity. Therefore, hardly reaches 3, or transferred, improved absorption properties surely have efficiency. COPYRIGHT: (C)2003,JPO