Electronic packaging reflow shape prediction for the solder mask defined ball grid array

摘要: The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. fatigue-induced solder joint failure surface mounted devices has become one the most critical reliability issues in packaging industry. Prediction shape drawn special attention development for its practical engineering application. Many models have been developed based on energy minimization principle (Patra et al, 1995) or analytical method (Heinrich 1993, Liedtke 1993). These methods are extensively utilized design joint. However, it is important find suitable real In this study, an efficient numerical used predict shapes investigated results compared with Surface Evolver program. changes geometric respect different parameters also discussed paper. influences such as volumes joint, package weight, contact angles, pads sizes, tension, gravity forces investigated. Results presented study can be determined optimal balanced stand-off height Single Ball Module (SBM) Multiple (MBM) models.