作者: Seog-woo Hong , Byeoung-ju Ha , Kuang-woo Nam , In-Sang Song , Duck-Hwan Kim
DOI:
关键词: Etching 、 Duplexer 、 Layer (electronics) 、 Inductor 、 Optoelectronics 、 Substrate (printing) 、 Electrical engineering 、 Materials science 、 Electrode 、 Piezoelectricity 、 Air gap (plumbing)
摘要: A method for fabricating subminiature, high-performance monolithic duplexer is disclosed. The comprises depositing and patterning a lower electrode on an upper surface of insulation layer substrate, so as to expose first part the layer; piezoelectric exposed electrode; metal form resonance trimming inductor, wherein electrically couples inductor; air gap type FBARs (film bulk acoustic resonances) by forming cavity etching substrate under part; bonding packaging having phase shifting which substantially prevents inflow signal between FBARs.