Direct bonding of copper to aluminum nitride
作者： M Entezarian , RAL Drew , None
DOI: 10.1016/0921-5093(96)10190-8
关键词: Intermediate layer 、 Aluminium 、 Atmospheric temperature range 、 Analytical chemistry 、 Copper 、 Direct bonding 、 Materials science 、 Wetting 、 Activation energy 、 Nitride 、 Metallurgy
摘要: … developed for bonding copper to alumina. … copper and ceramic is low and, as a result, high power and high frequency operation is possible. Another advantage of direct bonding copper …
elsevier.com
sci-hub.se 参考文章(7)
Joseph Newton, Curtis L. Wilson, Metallurgy of copper John Wiley , Chapman & Hall. ,(1942)
E. G. West, Copper and its alloys E. Horwood , Halsted Press. ,(1982)
G.A. Slack, Nonmetallic crystals with high thermal conductivity Journal of Physics and Chemistry of Solids. ,vol. 34, pp. 321- 335 ,(1973) , 10.1016/0022-3697(73)90092-9
N. Kuramoto, H. Taniguchi, Transparent AIN ceramics Journal of Materials Science Letters. ,vol. 3, pp. 471- 474 ,(1984) , 10.1007/BF00720974
Reinhard Glang, Leon I. Maissel, Paul P. Budenstein, Handbook of Thin Film Technology ,(1970)
Jack H. Enloe, Roy W. Rice, John W. Lau, R. Kumar, S.Y. Lee, Microstructural Effects on the Thermal Conductivity of Polycrystalline Aluminum Nitride Journal of the American Ceramic Society. ,vol. 74, pp. 2214- 2219 ,(1991) , 10.1111/J.1151-2916.1991.TB08287.X
S. K. RHEE, Wetting of AlN and TiC by Liquid Ag and Liquid Cu Journal of the American Ceramic Society. ,vol. 53, pp. 639- 641 ,(1970) , 10.1111/J.1151-2916.1970.TB12031.X