Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection
作者： X.P. Zhang , C.B. Yu , Y.P. Zhang , S. Shrestha , L. Dorn
DOI: 10.1016/J.JMATPROTEC.2007.04.072
关键词: Composite material 、 Materials science 、 Laser beams 、 Soldering 、 Metallurgy 、 Creep 、 Creep rate 、 Thermal creep 、 Fracture (geology) 、 Lead (electronics)
摘要: … effect and the Cu alloying effect; the lead-free Sn–Ag–Cu–Bi … solder and deteriorate mechanical property of the soldered … strength between two solder joints (lead-free Sn–Ag–Cu–Bi and …
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