Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: experimental analysis

摘要: An experimental study was performed which examined the solid state growth kinetics of interfacial intermetallic compound layers formed between copper and high temperature, tin-rich solders 96.5Sn-3.5Ag (wt.%) 95Sn-5Sb. These results were compared with baseline data from 100Sn/copper system. Both 95Sn-5Sb exhibited individual Cu3Sn Cu6Sn5 at interface; thickness layer being a function aging time temperature. The total in solder/copper couple showed mixture linear √t dependencies lower temperatures 70,100, 135°C, t0.42 dependence 170 205°C. combined apparent activation energy 59 kJ/mol, Arrhenius plot knee low temperature data. 95Sn-5Sb/copper system three 61 kJ/mol.