Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support

摘要: The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of platen and hollow base. Inside the cavity is contained serpentine which can convey fluid capable heating and/or cooling to achieve regulation object placed platen, according data supplied by thermometric system that includes sensor associated said support. made electrically insulating thermally conducting ceramic, base being material whose expansion coefficient substantially equal platen. A thin-film electrical resistance be provided ensure and, optionally, measurement