Adaptive processes for improving integrity of surfaces
作者： William F. Leggett , Simon Regis Louis Lancaster-Laroque
DOI:
关键词: Engineering 、 Computer hardware 、 Engineering drawing 、 Process (computing)
摘要: A process for performing localized corrective actions to structure of an electronic device is described. The may include a mating surface configured receive another structured such that the two structures be, example, adhesively bonded together. are not improve but also prevent light within from escaping in undesired areas device. In some embodiments, action includes using removal tool remove identified portions surface. other different add material means automated inspection system.
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