Support vector machine-based inspection of solder joints using circular illumination
作者： T.S. Yun , K.J. Sim , H.J. Kim
DOI: 10.1049/EL:20000342
关键词: Soldering 、 Illumination Technique 、 Joint (geology) 、 Joint surface 、 Artificial intelligence 、 Engineering 、 Computer vision 、 Support vector machine 、 Svm classifier
摘要: A method for inspecting solder joints using support vector machines (SVMs) and a tiered circular illumination technique is proposed. The provides visual information that allows the 3D shape of joint surface to be determined. extracted features are used classify an SVM classifier. Experimental results show effectiveness proposed method.
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