Laser probes for the thermal and thermomechanical characterisation of microelectronic devices
作者： Wilfrid Claeys , Stefan Dilhaire , Sébastien Jorez , Luis-David Patiño-Lopez
DOI: 10.1016/S0026-2692(01)00078-7
关键词: Shearography 、 Optics 、 Laser 、 Electronic component 、 Materials science 、 Microelectronics 、 Electronic speckle pattern interferometry 、 Electronics 、 Integrated circuit 、 Fault detection and isolation
摘要: This paper presents a review of some the recent works that we have done on thermal characterisation running electronic devices by laser probing. Both single point probing and surface imaging methodologies are considered. Besides temperature mapping, allows fault detection in integrated circuits. Electronic speckle pattern interferometry shearography metholologies presented, examples images power this relation to underlying thermomechanical stress shown.
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