Reduction of transfer of vibrations
作者： Philippe Bellé , Nicolas Merlette
DOI:
关键词: Loss factor 、 Dissipative system 、 Transfer (computing) 、 Composite material 、 Structural engineering 、 Reduction (mathematics) 、 Layer (electronics) 、 Vibration 、 Stiffness 、 Materials science
摘要: The invention discloses a dissipative vibration damping device (1 ), comprising carrier (2) having an inner surface and outer surface, the being on at least one thereof bonding layer (3), wherein is has loss factor of 0,2 (3) made rigid material with higher stiffness than (2). Also disclosed system method using such device.
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