Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
作者： Tadanori Shimoto , Koji Matsui , Kazuhiro Baba , Katsumi Kikuchi
DOI:
关键词: Semiconductor device 、 Layer (electronics) 、 Optoelectronics 、 Conductor 、 Interconnection 、 Materials science 、 Electrical engineering 、 Electrode 、 Substrate (printing)
摘要: An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; interconnection set on obverse surface of the electrode which is reverse side layer and formed in such way that, at least, lateral face end all round brought into contact with layer, while, not said via conductor disposed so as to connect this interconnection; supporting structure layer.
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