Semiconductor device, semiconductor package, and electronic system
作者： Ho-Joon Lee , Ji-Woong Sue , Jeong-Gi Jin , Joo-Hee Jang
DOI:
关键词: Optoelectronics 、 Signal 、 Substrate (printing) 、 Semiconductor package 、 Materials science 、 Front (oceanography) 、 Semiconductor device 、 Electronic systems 、 Electrical conductor
摘要: Provided are a semiconductor device, package, and an electronic system. The device includes substrate having front side back disposed opposite the side. An internal circuit is on or near to of substrate. Signal I/O through-via structures in Back conductive patterns electrically connected signal structures. A structure spaced apart from parallel supporter portions.
lens.org 参考文章(19)
Nikolai Y. Kozlovski, Donald Mark Haines, Edwin Struble, Madjid A. Belkerdid, Wireless surface acoustic wave corrosion sensor and interrogation system for concrete structures ,(2012)
William S. Beggs, Thomas P. Welch, Suku Kim, Jim Pierce, Mike D. Gruenhagen, James J. Murphy, Nickel-titanum soldering layers in semiconductor devices ,(2009)
Takayoshi Ito, Yukako Tsutsumi, Shuichi Obayashi, Antenna device and wireless apparatus ,(2012)
Azar Sadygov, Ziraddin Yagub-Ogly Sadygov, Abdelmounaime Faouzi Zerrouk, Serge Khorev, Azman Mohd Ariffin, Photodetector array and method of manufacture ,(2012)
Frank Bäuerlein, Walter Kodim, An electrical component and an electrical circuit module having connected ground planes ,(1999)
Hao-Chun Tung, Shih-Wen Lu, Antenna assembly for use in a telecommunication device ,(2006)
Chen-Hua Yu, Shau-Lin Shue, Chien-Ming Chiu, Hung-Pin Chang, Tsang-Jiuh Wu, Multi-Layer Interconnect Structure for Stacked Dies ,(2010)
James G. Maveety, Gregory M. Chrysler, Fay Hua, Kramadhati V. Ravi, Apparatus to minimize thermal impedance using copper on die backside ,(2008)
Ching-Fai Cho, Compact stripline low frequency band reject filter ,(2007)