Touchpad structure and manufacturing method thereof
作者： Chien-Wen Tsai , Yu-Kai Lin , Ming-Lung Ho
DOI:
关键词: Layer (electronics) 、 Optoelectronics 、 Materials science 、 Substrate (printing) 、 Electronic engineering 、 Electromagnetic shielding 、 Touchpad 、 Forming processes
摘要: A touchpad structure includes a substrate, shielding layer and sensing layer. The fully covers first surface of the substrate. By using circuit forming process to form on so as make sandwiched between substrate layer, structural thickness manufacturing processes overall can be significantly reduced.
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