作者: Chunnan Zhou , Simeon Chou
DOI:
关键词: Radiator 、 Substrate (printing) 、 Fastener 、 Engineering 、 Base (geometry) 、 Central processing unit 、 Thermal management of electronic devices and systems 、 Mechanical engineering 、 Mechanism (engineering) 、 Structural engineering
摘要: A heat dissipation assembly for a central processing unit includes radiator adapted to contact the from above and base support below. The at least snap-on fastening mechanism snap into through hole formed in supporting substrate of unit. fastener receiving portion an elongated aligning with matching engaging element mechanism.