Ball contact for flip-chip devices
作者： Anthony M. Chiu
DOI:
关键词: Semiconductor device 、 Contact area 、 Compressible material 、 Conductive materials 、 Flip chip 、 Materials science 、 Composite material 、 Ball (bearing) 、 Electrical conductor
摘要: A contact for a semiconductor device or passive substrate is made up of an array conductive balls, the individual balls being compressible material coated with metal material. The in are compressed while bonded to area provide larger bond between ball and which it bonded.
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