Improved wafer-scale fabrication of aligned pdms-glass microchips with integrated electrodes

摘要: We report an improved fabrication process of PDMS-based hybrid chips at the scale a whole wafer and including alignment step. This implies control dimension variations this elastomer upon temperature changes production PDMS compatible with use standard bonding equipment. illustrate applicability for PDMS-glass microchips electrodes; final in routine was 40 m end process.