Molecular dynamics simulation of Ni thin films on Cu and Au under nanoindentation
作者： D. Chocyk , T. Zientarski
DOI: 10.1016/J.VACUUM.2017.10.008
关键词: Deformation (engineering) 、 Layer (electronics) 、 Composite material 、 Nanoindentation 、 Indentation 、 Thin film 、 Diamond cubic 、 Crystallography 、 Substrate (electronics) 、 Materials science 、 Grain boundary
摘要: Abstract The deposition and indentation process in Ni/Au Ni/Cu systems were studied. Growth of Ni films on Cu Au substrate modelled to obtain for indentation. These during evaluated by employing molecular dynamics simulation with potentials based the embedded atom method theory. Additionally, two body Morse was included a rigid spherical indenter diamond structure used. Adaptive common neighbour analysis centrosymmetry parameter applied structural characterisation deposited layers. During stress gradually reaches constant value directly correlate changes layer forms BCC structure, but case Au, HCP intersected boundaries formed. increase hardness is linked decreasing thickness thermal system. A correlation between distribution deformation found. plastic propagates uniformly from centre indentation, along grain boundaries, additionally.
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