Characterization of diffusion induced grain boundary migration in the Ag/Cu system

作者: Zhuoming Guan , Guoxun Liu , Juan Du

DOI: 10.1016/0956-7151(93)90180-Z

关键词: CopperGrain boundary migrationMineralogyKineticsChemical physicsGrain boundaryDiscontinuity (geotechnical engineering)Materials scienceElectron microprobeMicrostructure

摘要: Abstract The phenomenon of diffusion induced grain boundary migration (DIGM) when silver diffuses along copper's boundaries was confirmed through the characterization microstructure and morphology migrated boundaries, discontinuity asymmetric character concentration profile, dislocation configuration kinetics by means SEM, EPMA, TEM AEM. experimental results were discussed to prove existence characteristics DIGM in Ag/Cu system.

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