作者: Zhuoming Guan , Guoxun Liu , Juan Du
DOI: 10.1016/0956-7151(93)90180-Z
关键词: Copper 、 Grain boundary migration 、 Mineralogy 、 Kinetics 、 Chemical physics 、 Grain boundary 、 Discontinuity (geotechnical engineering) 、 Materials science 、 Electron microprobe 、 Microstructure
摘要: Abstract The phenomenon of diffusion induced grain boundary migration (DIGM) when silver diffuses along copper's boundaries was confirmed through the characterization microstructure and morphology migrated boundaries, discontinuity asymmetric character concentration profile, dislocation configuration kinetics by means SEM, EPMA, TEM AEM. experimental results were discussed to prove existence characteristics DIGM in Ag/Cu system.