Stacked integrated circuit package having recessed sidewalls
作者： Seung-Woo Choi , Jong-wook Lee , Jung-Ho Kim , Dae-Lok Bae , Pil-Kyu Kang
DOI:
关键词: Semiconductor 、 Microelectronics 、 Optoelectronics 、 Integrated circuit 、 Conductive materials 、 Stacking 、 Layer (electronics) 、 Materials science 、 Electrical engineering
摘要: Microelectronic packages are fabricated by stacking integrated circuits upon one another. Each circuit includes a semiconductor layer having microelectronic devices and wiring on the that selectively interconnects devices. After stacking, via is formed extends through at least two of stacked Then, filled with conductive material electrically contacts wiring. Related also described.
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