Heat-resistant adhesive for use especially in making sterilizable packaging

摘要: Polyamide/epoxy, thermoplastic-thermoset curable adhesive resin systems which are aqueous dispersions disclosed; wherein the epoxy component has unreacted groups numbering, on average, between about 2 and 8; polyamide comprises both an acid terminated having number, of from 10 to 30, in amount 20% 60% by weight total resin, amine 5 80% 40% resin; additionally a neutralizing base sufficient neutralize 50% 80%, equivalents basis, number free occurring components; optionally at least one water soluble, dipolar chemical moiety effective provide stability overall composition; surfactant. The disclosed exhibit separation, premature curing or significant reaction room temperature for six months, capable forming bond elevated temperatures which, once formed, will maintain its integrity under high temperature, pressure moisture conditions autoclave sterilization. They find particular application producing packaging containers enclosing isolating object be sterilized, e.g., surgical instrument.