Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling

作者: Gregory Shmunis

DOI:

关键词: CoolantMaterials scienceMechanical engineeringElectrical interconnectInterconnectionStructural engineeringAxial symmetry

摘要: A liquid-cooled assembly of heat-generating devices which are mounted on an electrical interconnect structure. hydraulic structure transfers coolant between chambers associated with the devices. Flexible tubular members form inlets and outlets chambers. The flexible mewmbers radially axially rigid, is sealed to by compressed seals.

参考文章(4)
Kurt E. Petersen, Dean E. Eastman, Jerome M. Eldridge, Graham Olive, Cooling system for VLSI circuit chips ,(1984)
Shigeo Ohashi, Motohiro Sato, Kenichi Kasai, Heikichi Kuwabara, Wataru Nakayama, Tadakatsu Nakajima, Semiconductor cooling apparatus ,(1988)