Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging
作者： Lizhuang Yang , Wei Zhou , Yong Ma , Xuezheng Li , Yinghua Liang
DOI: 10.1016/J.MSEA.2016.05.015
关键词: Soldering 、 Composite material 、 Materials science 、 Elastic modulus 、 Nanoindentation 、 Ultimate tensile strength 、 Microstructure 、 Metallurgy 、 Sintering 、 Composite number 、 Ductility
摘要: In this study, Ni functionalized Sn58Bi solder alloys were successfully synthesized. Composite solders up to 1 wt% Ni reinforcement were prepared. Microstructures and mechanical …
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