Method and apparatus for solder-less attachment of an electronic device to a textile circuit
作者： Nitin B. Desai , Alan R. Beatty , Rami C. Levy , Bonnie J. Bachman , Ronald J. Kelley
DOI:
关键词: Electronic circuit 、 Substrate (printing) 、 Image stitching 、 Materials science 、 Process (computing) 、 Soldering 、 Semiconductor 、 Composite material 、 Electrical conductor 、 Electrical contacts
摘要: A method and apparatus form electrical connections between electronic circuits conductive threads ( 102, 104, 106, 108 ) that are interwoven into textile material 130 ). Electronic 128 ), such as semiconductor dies, connected to a carrier 132 136 made connection areas 110, 112, 114, 116 on the Conductive stitching 202, 204, 206, 208 provides contacts for both Optionally, thin, flexible substrate is perforated during process.
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