Flip chip type semiconductor device and method for manufacturing the same
作者： Hirokazu Honda
DOI:
关键词: Layer (electronics) 、 Materials science 、 Flip chip 、 Semiconductor chip 、 Solder ball 、 Electronic engineering 、 Optoelectronics 、 Substrate (electronics) 、 Semiconductor device 、 Electrical conductor
摘要: A multilayer wiring structure is formed on a flat metal plate and then an entire surface of the etched away to thereby leave only layer. An insulating substrate having through hole sections bonded layer, conductive bonding agent embedded into section, semiconductor chip mounted solder ball coupled.
lens.org 参考文章(4)
Roy Yu, Kimberley A. Kelly, Ashwani K. Malhotra, Eric D. Perfecto, Process for transferring a thin-film structure to a substrate ,(1999)
Akio Takahashi, Haruo Akahoshi, Ryuji Watanabe, Masahiro Suzuki, Junichi Katagiri, Yoichi Daiko, Takao Miwa, Osamu Miura, Tsutomu Imai, LSI package board ,(1995)
Hamaguchi Tsuneo, Ishizaki Mitsunori, Toshida Kenji, Tsuruta Akizo, Nagamine Takahiro, Kitamura Yoichi, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF ,(2001)
Hidekatsu Sekine, 秀克 関根, Semiconductor device and manufacture thereof ,(1996)