Bonding nature of rare-earth-containing lead-free solders

摘要: The ability of rare-earth-containing lead-free solders to wet and bond silica was investigated. Small additions Lu (0.5–2 wt. %) added eutectic Sn–Ag or Au–Sn solder render it directly solderable a silicon oxide surface. bonding is attributed the migration rare-earth element solder–silica interface for chemical reaction creation an interfacial layer that contains oxide. It found materials did not significantly modify solidification microstructure melting point. Such oxide-bondable can be useful assembly various optical communication devices.