作者: Takamichi Fujii , Yoshikazu Hishinuma , Tsuyoshi Mita , Takayuki Naono
DOI: 10.1016/J.SNA.2010.08.019
关键词: Materials science 、 Silicon 、 Metallurgy 、 Thin film 、 Sputtering 、 Composite material 、 Piezoelectricity 、 Wafer 、 Substrate (electronics) 、 Microelectromechanical systems 、 Sputter deposition
摘要: … for Pb loss during film formation. The ratio of Zr to Ti was set to be 0.52:0.48 which is MPB ratio. Additionally, 12% Nb was added in order to improve the piezoelectric properties. An RF …