Thermal Stress Based Power Routing of Smart Transformer With CHB and DAB Converters
作者： Vivek Raveendran , Markus Andresen , Giampaolo Buticchi , Marco Liserre
DOI: 10.1109/TPEL.2019.2935249
关键词: Power electronics 、 Reliability engineering 、 Converters 、 Thermal 、 Stress (mechanics) 、 Transformer 、 Computer science
摘要: The smart transformer (ST) is a potential solution for an upgrade of the electric distribution grid, which enables to provide services grid and dc connectivity. However, power electronics within system are challenged by high reliability requirements. One possible increase employ prognosis predict failures avoid down times system. Traditional maintenance scheduling based on remaining useful lifetime (RUL) individual components or forecasted failure probability. For further time next maintenance, it desired have similar wear out all components, need be maintained exchanged. In this article, proposed route internally in modular converter consisting cascaded H-bridge connected dual active bridges order influence RUL its building blocks. Therefore, thermal stress wear-out control designed addressing processed dependent devices blocks ST. Compared conventional routing methods, impact system-level considering electrical parameter variations demonstrated using Monte Carlo analysis.
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