Substrate unpacking device
作者： Wang Yongqiang , Li Xiande , Lin Kunhsien , Wu Chunhao , Guo Zhenhua
DOI:
关键词: Mechanism (engineering) 、 Substrate (printing) 、 Adsorption 、 Optoelectronics 、 Spring (mathematics) 、 Unpacking 、 Materials science
摘要: The embodiment of the invention discloses a substrate unpacking device, which comprises connecting plate, plurality adsorption components and height detection sensors. are used for absorbing target objects, sensors respectively arranged between plate components. Each is provided with guide rod, spring an tail end, one end rod connected sensor, other sleeved on located sensor. device has advantages that fragments reduced mechanism protected from damaging, like.
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