作者: Songkran Wiriyasart , Paisarn Naphon
DOI: 10.1016/J.CSITE.2020.100590
关键词: Composite material 、 Coolant 、 Mass flow rate 、 Materials science 、 Thermal resistance 、 Thermal conductivity 、 Heat sink 、 Heat capacity rate 、 Thermal 、 Evaporator
摘要: Abstract The thermal performance of the vapor chamber with different configuration structures for high power electronics is investigated experimentally. An experimental system designed and constructed to test chambers. seven chambers divided into 4 groups which consist (1) copper aluminum as fins, (2) channel width heat sink (1.2 mm 2.0 mm), (3) without mini-channel at evaporator, (4) diameter/number wick column structures, are investigated. monitored parameter mainly focuses on resistance relevant parameters. To achieve appropriate chamber, it depends operating conditions such coolant mass flow rate, source size, rate. Besides, evaporator area, using conductivity material smaller a sink. most important sintering structure, has small diameter, more columns have significant effect capillary augmentation enhancement chamber.