Thermal management system with different configuration liquid vapor chambers for high power electronic devices

作者: Songkran Wiriyasart , Paisarn Naphon

DOI: 10.1016/J.CSITE.2020.100590

关键词: Composite materialCoolantMass flow rateMaterials scienceThermal resistanceThermal conductivityHeat sinkHeat capacity rateThermalEvaporator

摘要: Abstract The thermal performance of the vapor chamber with different configuration structures for high power electronics is investigated experimentally. An experimental system designed and constructed to test chambers. seven chambers divided into 4 groups which consist (1) copper aluminum as fins, (2) channel width heat sink (1.2 mm 2.0 mm), (3) without mini-channel at evaporator, (4) diameter/number wick column structures, are investigated. monitored parameter mainly focuses on resistance relevant parameters. To achieve appropriate chamber, it depends operating conditions such coolant mass flow rate, source size, rate. Besides, evaporator area, using conductivity material smaller a sink. most important sintering structure, has small diameter, more columns have significant effect capillary augmentation enhancement chamber.

参考文章(53)
Paisarn Naphon, Songkran Wiriyasart, On the Thermal Performance of the Vapor Chamber with Micro-channel for Unmixed Air Flow Cooling Engineering Journal. ,vol. 19, pp. 125- 137 ,(2015) , 10.4186/EJ.2015.19.1.125
Paisarn Naphon, Songkran Wiriyasart, Effect of sintering columns on the heat transfer and flow characteristics of the liquid cooling vapor chambers Heat and Mass Transfer. ,vol. 52, pp. 1807- 1820 ,(2016) , 10.1007/S00231-015-1699-8
Ahmed A.A. Attia, Baiumy T.A. El-Assal, Experimental investigation of vapor chamber with different working fluids at different charge ratios Ain Shams Engineering Journal. ,vol. 3, pp. 289- 297 ,(2012) , 10.1016/J.ASEJ.2012.02.003
Shyy Woei Chang, Kuei Feng Chiang, Tsung Han Lee, Thermal performance of thin loop-type vapor chamber Experimental Thermal and Fluid Science. ,vol. 61, pp. 130- 143 ,(2015) , 10.1016/J.EXPTHERMFLUSCI.2014.10.016
G.S. Hwang, Y. Nam, E. Fleming, P. Dussinger, Y.S. Ju, M. Kaviany, Multi-artery heat pipe spreader: Experiment International Journal of Heat and Mass Transfer. ,vol. 53, pp. 2662- 2669 ,(2010) , 10.1016/J.IJHEATMASSTRANSFER.2010.02.046
Hafiz Muhammad Ali, Hassan Ali, Hassan Liaquat, Hafiz Talha Bin Maqsood, Malik Ahmed Nadir, Experimental investigation of convective heat transfer augmentation for car radiator using ZnO–water nanofluids Energy. ,vol. 84, pp. 317- 324 ,(2015) , 10.1016/J.ENERGY.2015.02.103
K. N. Shukla, A. Brusly Solomon, B. C. Pillai, THERMAL PERFORMANCE OF VAPOR CHAMBER WITH NANOFLUIDS Frontiers in Heat Pipes (FHP). ,vol. 3, ,(2013) , 10.5098/FHP.V3.3.3004
Ram Ranjan, Jayathi Y. Murthy, Suresh V. Garimella, David H. Altman, Mark T. North, Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux Applications IEEE Transactions on Components, Packaging and Manufacturing Technology. ,vol. 2, pp. 1465- 1479 ,(2012) , 10.1109/TCPMT.2012.2194738
Yi Peng, Wangyu Liu, Ningling Wang, Yufu Tian, Xuelin Chen, A novel wick structure of vapor chamber based on the fractal architecture of leaf vein International Journal of Heat and Mass Transfer. ,vol. 63, pp. 120- 133 ,(2013) , 10.1016/J.IJHEATMASSTRANSFER.2013.02.021
P. Naphon, S. Wongwises, S. Wiriyasart, Application of two-phase vapor chamber technique for hard disk drive cooling of PCs International Communications in Heat and Mass Transfer. ,vol. 40, pp. 32- 35 ,(2013) , 10.1016/J.ICHEATMASSTRANSFER.2012.10.014