作者: Anton Rozen , Michael Priel , Leonid Fleshel
DOI:
关键词: Operability 、 Wafer dicing 、 Engineering 、 Die (manufacturing) 、 Integrated circuit 、 Capacitance 、 Wafer 、 Decoupling capacitor 、 Capacitive sensing 、 Electrical engineering
摘要: A bypass capacitor circuit for an integrated (IC) comprises one or more capacitive devices, each arranged in a segment of seal ring area die, which the IC. method providing capacitance IC semiconductor wafer device comprising plurality dies, IC; arranging devices at least dicing device; test mode, enabling device, determining operability parameter value indicative and storing memory normal operation to depending on having associated non-defectiveness corresponding device.