The Carbon Footprint of PECVD Chamber Cleaning Using Fluorinated Gases

作者: M. Schottler , M.J. de Wild Scholten

DOI: 10.4229/23RDEUPVSEC2008-3AV.2.56

关键词: Materials scienceCarbon footprintBottleEtching (microfabrication)Plasma-enhanced chemical vapor depositionFluorinated gasesWaste managementGlobal warmingComposite materialGreenhouse gasFugitive emissions

摘要: Fluorinated gases like CF4, C2F6, SF6, NF3, F2 by on-site generation can be used the semiconductor and photovoltaic industry for etching silicon wafers (PE)CVD chamber cleaning. Avoidance of emission SF6 NF3 is required because they have a high global warming effect atmospheric life-time. In this work comparison made carbon footprint from use these in The calculated as total greenhouse gas emissions over whole life-cycle gases. steps life cycle are following: production compounds, transportation, distribution fab (connection cylinders), process, abatement to destroy unreacted take-back cylinders. Emissions each step direct (from fluorinated gases) or indirect energy use). Preliminary results (excluding onsite recycling), partly based on best guesses, indicate that dominated rest after usage phase, followed fugitive during downtime system cleaning not completely empty returned generated turns out clearly advantage other compounds has potential zero. Possible improvement options minimize (1) strict procedure connection cylinders, (2) complete reliable bottle, (3) recovery unused process (4) good end-point detection process.

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