作者: Satoru Yoneyama , Takenobu Sakai , Koichi Okabe
关键词: Reinforcement 、 Stress relaxation 、 Composite material 、 Semiconductor device 、 Epoxy 、 Viscosity 、 Glass transition 、 Viscoelasticity 、 Dynamic mechanical analysis 、 Materials science
摘要: Glass powder reinforced epoxy was used in the fields of plastic sealing semiconductor devices. In such environment, materials were exposed high temperature, and visco-elastic behavior must occur materials. However, there are few reports about these focused on visco-elasticity. Therefore, analysis an important issue to be taken account. this study, stress relaxation dynamic mechanical composites filled with different amounts glass investigated. On analysis, transition temperature decreased increment amount contents. And viscosity at also when contents augmented. test, master curves obtained, time-temperature superposition principles ascertained. The slopes shift factors changed depending powder. calculated by using relationship between effect When increased, then shifted short time side. Comparing powder, it is understood that each material similar. showing reinforcement heat resistance discussed.