Synthesis and characterization of sputtered titanium nitride as a nucleation layer for novel neural electrode coatings

作者: R.A. Sait , R.B.M. Cross

DOI: 10.1016/J.APSUSC.2017.03.277

关键词: CrystalliteTinSputter depositionSputteringTitanium nitrideNucleationNanotechnologyThin filmChemical engineeringElectrodeMaterials science

摘要: Abstract A growing demand for chronically implantable electrodes has led to a search the most suitable neural electrode interface material. Nobel metals such as platinum (Pt) are inadequate electrode/neuron interfaces at small scales due their poor electrochemical properties, low charge injection and high density per unit area. Titanium nitride (TiN) been implemented in application its outstanding properties. In this work, TiNx films were deposited by non-reactive radio frequency (RF) magnetron sputtering towards development of novel TiN nanowires (NWs) interface. Although, there is substantial work on material, growth using RF not reported previously optimised NWs use applications. The parameters power argon (Ar) flow rate varied order investigate effects structural, electrical properties films. dense film morphology was observed scanning electron microscopy (SEM) images thin showing columnar structure. preferential orientation changed between (200) (111) with Ar variation kinetic energy (KE) sputtered atoms. crystallites size obtained range 13–95 nm. Surface roughness found increase from 0.69 1.95 nm increased. showed good resistivity 228 μΩ cm. Stoichiometry vary conditions which nitrogen content deplete rate. behaviour characterised highest capacitance value 0.416 mF/cm2. From results, it can be suggested that easily act nucleation layer nanowires.

参考文章(38)
Suzan Meijs, Morten Fjorback, Carina Jensen, Søren Sørensen, Kristian Rechendorff, Nico J. M. Rijkhoff, Electrochemical properties of titanium nitride nerve stimulation electrodes: an in vitro and in vivo study Frontiers in Neuroscience. ,vol. 9, pp. 268- 268 ,(2015) , 10.3389/FNINS.2015.00268
Young-Hoon Shin, Yukihiro Shimogaki, Diffusion barrier property of TiN and TiN/Al/TiN films deposited with FMCVD for Cu interconnection in ULSI Science and Technology of Advanced Materials. ,vol. 5, pp. 399- 405 ,(2004) , 10.1016/J.STAM.2004.02.001
P. Daubinger, J. Kieninger, T. Unmüssig, G. A. Urban, Electrochemical characteristics of nanostructured platinum electrodes – a cyclic voltammetry study Physical Chemistry Chemical Physics. ,vol. 16, pp. 8392- 8399 ,(2014) , 10.1039/C4CP00342J
Yaqin Wang, Wu Tang, Lan Zhang, Crystalline Size Effects on Texture Coefficient, Electrical and Optical Properties of Sputter-deposited Ga-doped ZnO Thin Films Journal of Materials Science & Technology. ,vol. 31, pp. 175- 181 ,(2015) , 10.1016/J.JMST.2014.11.009
S Niyomsoan, W Grant, D.L Olson, B Mishra, Variation of color in titanium and zirconium nitride decorative thin films Thin Solid Films. ,vol. 415, pp. 187- 194 ,(2002) , 10.1016/S0040-6090(02)00530-8
Kah-Yoong Chan, Bee-San Teo, Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films Journal of Materials Science. ,vol. 40, pp. 5971- 5981 ,(2005) , 10.1007/S10853-005-1362-8
Hongxiu Du, Yibing Xie, Chi Xia, Wei Wang, Fang Tian, Electrochemical capacitance of polypyrrole–titanium nitride and polypyrrole–titania nanotube hybrids New Journal of Chemistry. ,vol. 38, pp. 1284- 1293 ,(2014) , 10.1039/C3NJ01286G
Ana Ruiz, Elisa Román, Pilar Lozano, Mariano García, Luis Galán, Isabel Montero, David Raboso, None, UHV reactive evaporation growth of titanium nitride thin films, looking for multipactor effect suppression in space applications Vacuum. ,vol. 81, pp. 1493- 1497 ,(2007) , 10.1016/J.VACUUM.2007.04.007